Intel NDTM US LLC

An embodiment of a memory device may include a full block memory array of a lower tile of 3D NAND string memory cells, a full block memory array of an upper tile of 3D NAND string memory cells, a first portion of a string driver circuit coupled to the full block memory array of the lower tile, a second portion of the string driver circuit coupled to the full block memory array of the upper tile, a first split block memory array of the lower tile coupled to the first portion of the string driver circuit, and a second split block memory array of the upper tile coupled to the second portion of the string driver circuit. Other embodiments are disclosed and claimed.

Systems, apparatuses and methods may provide for technology that sends a first command to a NAND die, sends first address information to the NAND die, and sends a second command to the NAND die, wherein the first command and the second command define a first command sequence and wherein the first address information signal a beginning of a first asynchronous read request from a first plurality of planes. In one example, the technology also sends a second command sequence and second address information to the NAND die wherein the second command sequence signals an end of the first asynchronous read request.

Systems, apparatuses and methods may provide for technology that boosts strings of a plurality of NAND sub-blocks to a pass voltage, deboosts a first subset of the boosted strings based on data associated with the plurality of NAND sub-blocks, and simultaneously programs the first subset while a second subset of the boosted strings remain at the pass voltage. In one example, to boost the strings of the NAND sub-blocks, the technology applies the pass voltage to selected and unselected wordlines that are connected to the NAND sub-blocks while selected and unselected strings are disconnected from a bitline that receives the data associated with the NAND sub-blocks.

An apparatus, a method and a system. The apparatus comprises a memory array including word lines defining a staircase structure, and a staircase etch stop layer including: a sandwich etch stop layer disposed on a top region the staircase and including a first etch stop layer and a third etch stop layer of a first material, and a second etch stop layer sandwiched between the first etch stop layer and the third etch stop layer and made of a second material having etch properties different from the first material; a precut etch stop layer disposed at a region of the staircase structure below the top region and including the second etch stop layer and the third etch stop layer and not the first etch stop layer; and contact structures extending through a dielectric layer and the staircase etch stop layer and landing on the word lines at the staircase structure.

An embodiment of a memory device may comprise a vertical channel, a first memory cell formed on the vertical channel, a first wordline coupled to the first memory cell, a second memory cell formed on the vertical channel immediately above the first memory cell, a second wordline coupled to the second memory cell, and an airgap disposed between the first wordline and the second wordline. Other embodiments are disclosed and claimed.

A sense circuit performs a multistage boost, including a boost during precharge operation and a boost during the standard boost operation. The sense circuit includes an output transistor to drive a sense output based on current through a sense node which drives a gate of the output transistor. The sense circuit includes a precharge circuit to precharge the sense node and the gate of the output transistor and a boost circuit to boost the sense node. The boost circuit can be boosted during precharge by a first boost voltage, resulting in a lower boost applied to the sense node after precharge. The boost circuit boosts up the sense node by a second boost voltage lower than the first boost voltage. The boost circuit boosts the sense node down by the full boost voltage of the first boost voltage plus the second boost voltage after sensing.

At the end of or after a reading operation in a 3D (three dimensional) NAND array, the wordlines of the 3D NAND array can be transitioned to ground in a staggered manner. The 3D NAND array includes a 3D stack with multiple wordlines vertically stacked, including a bottom-most wordline, a top-most wordline, and middle wordlines between the bottom-most wordline and the top-most wordline. A controller that controls the reading can set the multiple wordlines to a high voltage at the end or after the reading operation and then transition a selected wordline of the multiple wordlines from the high voltage to ground prior to transitioning the other wordlines to ground. Thus, the controller will transition the other wordlines from the high voltage to ground after a delay.

Systems, apparatuses, and methods may provide for technology that simultaneously forms staircase areas and CMOS (complementary metal-oxide-semiconductor) contact areas in three-dimensional (3D) NAND memory. A 3D NAND memory includes a first CMOS contact area and a first staircase area. The first CMOS contact area is formed through a plurality of sequential chops. The first staircase area is formed through a plurality of sequential staircase chops. The first CMOS contact area is formed through the plurality of sequential chops being performed simultaneous to the plurality of sequential staircase chops.

An apparatus is described. An apparatus includes controller logic circuitry to perform a program-verify programming process to a flash memory chip. The program-verify programming process is to reduce a size of a pre-program verify (PPV) bucket in response to a number of cells being fully programmed to a same digital state. The number of cells are less than a total number of cells to be programmed to the same digital state.

Power consumption of sensing circuitry in a NAND Flash device is reduced by reducing the voltage supply to a portion of logic circuits in sensing circuitry. A first power domain provides power to a first portion of the logic circuits in the sensing circuity and a second power domain provides power to a second portion of the logic circuits in the sensing circuitry. The first power domain has a higher voltage than the second power domain.