Company patents

Intel NDTM US LLC

Intel NDTM US LLC's patent strategy reveals a strong, sustained focus on core semiconductor memory technologies, with Memory & Storage (Static) representing 61.0% of its portfolio and Memory Devices (Structural) showing an emerging focus with a 50.0% YoY growth in 2026 so far. While Input/Output & User Interfaces saw a dramatic 266.7% surge in 2025, its sharp decline of 81.8% in 2026 suggests a shifting priority away from this area, contrasting with the consistent investment in memory innovation.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

105 US filings (since 2023) · 8 categories · 10 themes

Advanced Memory Cell Structures

Focuses on the physical design, materials, and manufacturing processes for individual memory cells, including transistor structures, interconnects, and multi-layered (3D) architectures to enhance density and performance.

Memory & Storage (Static)Memory Devices (Structural)
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60since 2023
+21.4%YoY
Resistive & Phase Change Memory

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Memory Devices (Structural)
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41since 2023
0.0%YoY
Memory System Performance & Reliabilityfiltered

Hardware and control techniques for optimizing memory access latency, ensuring data integrity, and managing storage resources efficiently. This includes error correction, read/write voltage control, and intelligent data placement or in-memory computation.

Memory & Storage (Static)
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37since 2023
+128.6%YoY
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Memory Devices (Structural)Semiconductor Packaging & Encapsulation
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29since 2023
+33.3%YoY
Memory Reliability, Testing & Repair

Methods and circuits for detecting and mitigating defects, ensuring data integrity, and enabling self-testing and repair mechanisms within memory devices and subsystems.

Memory & Storage (Static)
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16since 2023
+133.3%YoY
In-Memory Sensing & Data Path

Design and operation of analog and mixed-signal circuits within the memory array, such as page buffers, sense amplifiers, and data latches, responsible for reading and writing data from/to memory cells.

Memory & Storage (Static)
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13since 2023
+133.3%YoY
Advanced Material Characterization

Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.

Electrical Measurement
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5since 2023
-50.0%YoY
Semiconductor Electrical Test

Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.

Electrical Measurement
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5since 2023
-50.0%YoY
Vertical Interconnects & Vias

Design and manufacturing methods for creating vertical electrical connections, such as conductive pillars, via-wirings, and contact rings, which are essential for connecting different layers in 3D integrated circuits and packages.

Memory Devices (Structural)
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3since 2023
new
High-Speed Clock & Data

Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.

Pulse / Digital Logic Circuits
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1since 2023
new

Patents

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