KELK Ltd.

A thermoelectric module is a thermoelectric module that performs temperature control on a temperature control target object, the thermoelectric module including: a plurality of thermoelectric elements that are provided between the temperature control target object and a substrate that is disposed to face the temperature control target object in a first direction; and a plurality of electrodes that are provided on each of a substrate side and a temperature control target object side of the thermoelectric element and configured to electrically connect the thermoelectric elements adjacent to each other in a second direction intersecting the first direction, in which the electrode includes two electrode base portions that are spaced apart from each other in the second direction, and each of which is connected to a corresponding thermoelectric element, and a connecting portion connecting the two electrode base portions.

This thermoelectric material has a matrix in which a chemical formula is represented by A 2 B 3 , A in the chemical formula is one or more elements selected from the group consisting of Bi and Sb, and B in the chemical formula is one or more elements selected from the group consisting of Te, Se and S, in at least one of crystal grains of the matrix and crystal grain boundaries of the matrix, oxide particles containing one or more elements selected from a group C consisting of Zn, Nb and Al and telluride particles containing one or more elements selected from the group C are precipitated.

A substrate support device includes a placement part formed in a plate shape which extends in a horizontal direction and having a placement surface on which a substrate is placed, and a movable part which makes the placement surface conform to the substrate by moving according to a warpage of the substrate placed on the placement surface. The movable part includes an arm part including an expansion and contraction part which expands and contracts in the horizontal direction according to the warpage of the substrate placed on the placement surface, an arm body having a longitudinal direction in a vertical direction in a state in which the substrate is not placed on the placement surface, and an arm connection part which connects a lower end of the arm body to an outer end of the expansion and contraction part in the horizontal direction.

A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partitioned in a plan view, a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions, a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region of which the temperature has been adjusted by the temperature adjustment part, and a control part configured to monitor detection temperatures of the plurality of temperature detection parts, to select one having a large temperature change per unit time among a plurality of monitored detection temperatures, and to control the temperature adjustment part based on the selected detection temperature.

An electrode connection structure includes a first electrode unit that includes first electrodes formed concentrically, and a second electrode unit that includes a second electrode formed into a needle shape axially movable forward and rearward and is electrically connectable to the first electrode unit, and in the electrode connection structure, the second electrode unit includes a plurality of the second electrodes that is arranged in a circumferential direction and arranged at different radial positions, and the plurality of the second electrodes is electrically connected to the first electrodes arranged at different radial positions, respectively.

A residual charge removal device includes: a power storage unit; a first switching unit that is connected to a target to which electric power is supplied from a power supply device, and operates to remove a residual charge of the target by electric power supplied from the power storage unit; and a second switching unit that operates to supply electric power from the power storage unit to the first switching unit when electric power supply to the target is stopped.

A wireless terminal includes a memory that stores a parameter, a microcomputer that operates in an operation mode, which is predetermined, on the basis of the parameter, and a wireless communication device that wirelessly receives a change command of the parameter. When the change command is wirelessly received, the microcomputer suspends the operation and changes the parameter on the basis of the change command.

A thermoelectric module includes: a lower substrate; an upper substrate that is disposed above the lower substrate and faces the lower substrate; a plurality of p-type and n-type thermoelectric elements that are disposed between the lower substrate and the upper substrate; a first electrode that is disposed on an upper surface of the lower substrate and a lower surface of the upper substrate and forms a series circuit by alternately and sequentially connecting the p-type and n-type thermoelectric elements; and a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end portion of the series circuit and a post. The post includes a post main body that is formed of titanium, and a titanium passive film that covers a side surface of the post main body.

A temperature control system includes: first adjusting the temperature of fluid in a first portion the fluid having a first temperature determined based on a second temperature higher than the first temperature or the second temperature; second adjusting the temperature of the fluid supplied to a target at a second portion between the first portion and the target; first detecting the temperature of first fluid supplied from the first to second portion; second detecting the temperature of the fluid or the target at a predetermined position between an outlet of the second portion and an inlet of the first portion; controlling the first adjusting based on the first detected value such that the temperature of the first fluid becomes a first temperature; and controlling the second adjusting based on a the second detected such that the temperature of the fluid becomes a second temperature at the predetermined position.

A processing liquid temperature control apparatus includes a block body with an integral structure made of a silicon carbide sintered body, the block body having a flow path through which a semiconductor processing liquid flows, and a temperature adjustment portion provided at the block body to adjust a temperature of the semiconductor processing liquid flowing through the flow path. Accordingly, it is possible to reduce the number of parts and achieve compactness and cost reduction. In addition, it is possible to enhance heat conduction between the processing liquid and the temperature adjustment portion, and improve heat exchange efficiency.