KELK Ltd.

Design and integration of thermoelectric modules for converting heat into electricity (power generation) or using electricity for cooling/heating, often involving p-type/n-type semiconductor pellets and waste heat recovery.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.

Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.

Systems and methods for transferring electrical energy without physical contact, often utilizing inductive or resonant coupling, including antenna design, resonance tracking, and control mechanisms for efficient power delivery.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Processes and apparatus for disassembling spent batteries and recovering valuable materials (e.g., metals, electrolytes, plastics) through mechanical, chemical, or electrochemical methods for reuse or sustainable disposal.