Company patents
MPI CORPORATION
MPI CORPORATION's patent strategy is overwhelmingly focused on Electrical Measurement, which constitutes 91.7% of its total portfolio, showing a significant surge in 2024 with an 83.3% YoY growth, though patenting activity in this core area has seen a -54.5% decline so far in 2026. Surprisingly, despite its dominance in Electrical Measurement, patenting in related areas like Semiconductor Testing has seen a consistent decline, with a -100.0% drop so far in 2026, indicating a potential shift away from direct semiconductor testing applications.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
72 US filings (since 2023) · 9 categories · 9 themes
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Integration of dedicated physical structures or built-in circuitry within semiconductor devices to enable characterization of process variations, material properties, electrical leakage, or device performance.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Patents
Showing 1-2 of 2
Laser Module Packaging