Company patents
PHOENIX PIONEER TECHNOLOGY CO., LTD.
PHOENIX PIONEER TECHNOLOGY CO., LTD. shows a surprising shift in its patent strategy, with significant declines across its core semiconductor categories, such as Semiconductor Packaging & Encapsulation (down 50.0% YoY in 2026 so far) and Chip-to-Chip Interconnect (Bonding, Bumps) (down 100.0% YoY in 2026 so far), despite these still representing the largest shares of its portfolio at 53.8% and 44.2% respectively. This indicates a potential re-evaluation of its traditional focus, especially given the dramatic 700.0% YoY growth in Magnets & Inductors in 2024, which, while declining in 2025 and 2026, suggests a past exploration of diversification outside its primary semiconductor domain.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
52 US filings (since 2023) · 9 categories · 14 themes
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Techniques and structures used to reduce unwanted electromagnetic coupling, scattering, or interference between multiple antennas, different frequency bands, or sensitive electronic components within a device.
Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.
Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Patents
Showing 1-7 of 7
Antenna Isolation & Interference Mitigation