Company patents
PlayNitride Display Co., Ltd.
PlayNitride Display Co., Ltd. demonstrates a shifting patent strategy, with a surprising decline in its historically dominant "LED & Optoelectronics (Legacy CPC)" category, which accounts for 50.7% of its portfolio, showing a dramatic -85.7% YoY drop in 2025 and -100.0% so far in 2026. Concurrently, the company shows an emerging focus on "Welding & Soldering," which experienced a rapid 350.0% YoY growth in 2025, suggesting a strategic pivot towards manufacturing process innovation despite a general slowdown in patent filings across most categories so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
229 US filings (since 2023) · 12 categories · 17 themes
Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.
Innovations in the internal design of individual light-emitting diode chips or packages, focusing on semiconductor layer arrangements, electrode configurations, reflective elements, and light extraction features.
Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.
Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.
Techniques and structural designs for assembling multiple display modules or panels to create a larger, continuous display with minimized visible seams, uniform light emission, and robust mechanical integrity.
Physical layout and material composition of individual pixels within a display panel, including active layers, electrodes, light-emitting elements (LEDs, OLEDs), and associated thin-film transistors (TFTs).
Design and implementation of circuits and layouts for driving individual pixels or rows/columns of pixels, including gate drivers, data drivers, pixel driving circuits, and their integration onto the display substrate, often in non-display regions.
LED devices and display systems designed to emit or utilize light across different spectral ranges, including visible and invisible light, or to create specific illumination patterns and immersive lighting experiences.
Techniques and circuits for optimizing power consumption, voltage stability, and energy efficiency in display panels, often involving dynamic voltage scaling, duty cycle control, or remnant voltage management.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Techniques and systems utilizing laser beams for precise material modification, including cutting, cladding, ablation, and surface treatment, often for joining, shaping, or removing material.
Algorithms and hardware implementations within display drivers or associated components to enhance visual quality, resolution, or color reproduction, including upscaling, dithering, and compensation for display artifacts like crosstalk.
Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Patents
Showing 1-5 of 5
Laser Material Processing