PURPLE CLOUD DEVELOPMENT PTE. LTD.

A heat dissipation module includes a fan assembly and a securing device. The fan assembly includes a fan including a fan frame and a fan blade. The fan blade is rotatably disposed in the fan frame. The fan frame includes a first assembling portion and a second assembling portion and both of them are arranged along an axial direction of the fan blade. The fan assembly further includes a fastener that movably extends through the first assembling portion and the second assembling portion. The fan assembly also includes a stopper that is mounted into the fastener and located between the first assembling portion and the second assembling portion. The fastener extends through the first assembling portion and the second assembling portion and is fastened to the securing device.

A fan device includes a fan frame including a base and a frame body, a fan blade rotatably disposed on the base, and at least one first mating structure and at least one second mating structure respectively disposed on the base and the frame body. The first mating structure is configured to attract the second mating structure so that the frame body is detachably secured to the base. The base includes a shell portion and at least one first assembly portion connected to the shell portion and extending toward the frame body. The frame body includes a frame portion and at least one second assembly portion connected to the frame portion and extending toward the base. The first mating structure has a mating recess, and the second mating structure includes a first protrusion portion, a second protrusion portion, and a disc portion disposed between the first and second protrusion portions.

A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.

A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing. The second thermally conductive casing is attached to the first thermally conductive casing to form a liquid-tight chamber. The heat transfer device further includes thermally conductive protrusions, first capillary structures that are disposed on the first thermally conductive casing, second capillary structures that are disposed on the thermally conductive protrusions and are thermally coupled with the first capillary structure, and first heat pipes that are extended through the first through holes and are in contact with the second capillary structures. In at least one the first pipes, a fourth capillary structures are disposed on an inner wall of the first heat pipe and is in contact with the second capillary.

A heat dissipation device includes a liquid-cooling radiator assembly, a fan mounting structure disposed on the liquid-cooling radiator assembly, a plurality of recesses formed on an outer side of the mounting structure, and a plurality of contact terminals mounted in the recesses, respectively. The heat dissipation device further includes a power connector disposed on one side of the mounting structure and electrically connected to the contact terminals, and at least two fans arranged side-by-side and mounted to the fan mounting structure, each fan having a plurality of spring pins. When the fans are secured to the fan mounting structure, each of the spring pins is in electrical contact with a corresponding contact terminal to form a power supply path among the power connector, the contact terminals, and the spring pins.

A fan module for cooling electronic devices comprises a first fan and a second fan detachably coupled together. The first fan includes a first housing having latching slots, a first engagement member defining a first engagement slot with a first opening oriented toward a corresponding latching slot, and a first fan blade disposed within the first housing. The second fan includes a second housing, a second engagement member detachably fitted in the first engagement slot of the first engagement member, and a second fan blade disposed within the second housing. A latching member is disposed in the corresponding latching slots and configured to prevent the second engagement member from disengaging from the first engagement member. When assembled, the rotational axes of the fan blades are aligned to direct airflow from the first fan into the airflow path of the second fan, providing enhanced cooling performance.

A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.

A vapor chamber includes a first cover, a second cover and a partition. The second cover and the first cover are bonded together to form a heat dissipation space. The second cover has at least two through holes. The at least two through holes correspond to the heat dissipation space. The at least two through holes are configured for at least two pipes to be inserted therein. The partition is located in the heat dissipation space, and protrudes from the first cover. The partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other. The partition surrounds the open subspace. The open subspace is in fluid communication with the at least two through holes.

A fan assembly includes a fan blade assembly and a fan frame, and the fan blade assembly includes a fan blade frame having an inner surface and a outer surface, a middle tube with a first magnet block mounted at a bottom portion thereof, a bearing disposed within the middle tube, a shaft disposed within the bearing, one end of the shaft is disposed on the inner surface of the fan blade frame, fan blades disposed on outer surface of the fan blade frame, and a magnetic assembly disposed within the fan blade assembly, and a fan frame includes a support frame with a support tube extending therefrom, the middle tube is configured to insert into the support tube, a second magnet block disposed within the support tube, a motor assembly mounted to an exterior of the support tube, the motor assembly including a PCB board mounted to a bottom portion thereof, wherein the first magnet block and the second magnet block are configured to magnetically attract one another when the middle tube is placed into the support tube.

A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.