Company patents
SHANGHAI METAPWR ELECTRONICS CO., LTD
SHANGHAI METAPWR ELECTRONICS CO., LTD surprisingly shifted its focus significantly in 2025, with categories like Semiconductor Packaging & Encapsulation growing by 800.0% YoY and Printed Circuits & Electronic Assemblies by 133.3% YoY, indicating a strong emerging emphasis on semiconductor manufacturing and assembly, despite a sharp decline in patent filings across most categories so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
46 US filings (since 2023) · 12 categories · 14 themes
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Development and manufacturing of semiconductor devices using wide bandgap materials like Silicon Carbide (SiC) or Gallium Nitride (GaN) for high-power, high-frequency, or high-temperature applications.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Techniques and circuits for accurately identifying various electrical faults, such as ground faults, overcurrent, short circuits, switch malfunctions, or electrostatic discharge (ESD) events, often utilizing sensors, signal processing, and diagnostic algorithms.
Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.
Techniques and systems for ensuring the safe and precise operation of lasers, including power regulation, hazard detection, and deconfliction mechanisms in complex or dynamic environments.
Techniques for manufacturing semiconductor laser chips, including active region design, mirror structures, current and optical confinement, and the integration of multiple layers or elements on a substrate.
Patents
Showing 31-40 of 46