Company patents
SKY TECH INC.
SKY TECH INC. appears to be significantly shifting its patent strategy, moving away from its historical core in "Coating & Surface Treatment," which constitutes 61.9% of its portfolio but saw a 40.0% decline in 2025 and no patents so far in 2026. While "Electron / Ion Tubes & Discharge" showed rapid growth of 166.7% in 2024, the complete absence of new patents across nearly all categories so far in 2026 suggests a dramatic re-evaluation or slowdown in its patenting activities.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
63 US filings (since 2023) · 11 categories · 12 themes
Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.
Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.
Involves the design and synthesis of semiconductor or perovskite nanocrystals and other nanostructures with tailored optical and electronic properties for advanced applications in light-emitting devices, displays, or quantum technologies.
Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.
Methods and systems for real-time monitoring and control of coating processes or chamber cleaning, utilizing sensor data (e.g., thermal, pressure, optical) and predictive models to ensure quality and optimize efficiency.
Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.
Patents
Showing 1-10 of 10
Electronic Component Bonding