Company patents
TE Connectivity Services GmbH
TE Connectivity Services GmbH's patent strategy shows a surprising and dramatic decline across nearly all categories, with its dominant 'Electrical Connectors' portfolio (63.4%) experiencing a -95.9% YoY drop in 2024 and further declines in 2025 and 2026. This widespread reduction, including -100.0% YoY declines in 'Printed Circuits & Electronic Assemblies' and 'Cables & Conductors' in 2024, suggests a significant shift away from new patenting activity across its traditional core and emerging areas, with only a single patent so far in 2026 in 'Industrial Control Systems' indicating any recent activity.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
123 US filings (since 2023) · 10 categories · 13 themes
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Structural design and manufacturing techniques for bundling multiple wires into harnesses, including protective layers like braiding and interlocking armor, and methods for assembly and termination.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Applying machine learning and artificial intelligence models to analyze industrial data, predict system behavior, and optimize control strategies for improved efficiency, quality, or environmental compliance in manufacturing and operations.
Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.
Technologies for efficiently delivering power to electric vehicles, encompassing fast charging, wireless charging, and smart grid integration, alongside vehicle-side control and management of the charging process.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.
Patents
Showing 1-10 of 557