TE Connectivity Services GmbH

A pressurizing device includes a pressurizing plate having a first pressurizing plate surface and a second pressurizing plate surface opposite to each other. The first pressurizing plate surface presses an electronic element located on a first circuit board surface of a circuit board. The pressurizing device includes a plurality of peripheral pressurizing units applying pressure to a peripheral region of the second pressurizing plate surface and a plurality of central pressurizing units applying pressure to a central region of the second pressurizing plate surface.

A receptacle connector assembly includes a receptacle cage including cage walls including a top wall and forming a module channel configured to receive a pluggable module. The top wall includes an opening open to the pluggable module. The receptacle connector assembly includes an EMI gasket coupled to the top wall at the opening. The EMI gasket provides electrical shielding at the opening. The EMI gasket has a base including a mounting surface coupled to the top wall of the receptacle cage. The EMI gasket has a plurality of mating interfaces. The receptacle connector assembly includes a heat sink coupled to the receptacle cage having a heat sink base with a thermal interface located in the module channel and configured to engage the pluggable module to dissipate heat from the pluggable module. The base engages the mating interfaces of the EMI gasket to electrically connect the heat sink to the EMI gasket.

A back plate configured to support a circuit board includes a body. The body defines a central recess formed into a top surface thereof, and a raised main support column extending from the central recess and adapted to support the circuit board.

A tamper sensor assembly that includes a substrate with a protective bulk section including tamper circuitry and a hardware section configured to receive hardware circuitry and extending from the protective bulk section; the hardware circuitry electrically connected to the tamper circuitry to alter operation of the hardware circuitry responsive to modification of the tamper circuitry. The substrate additionally includes an attachment section extending from the hardware section. The tamper sensor assembly also includes a first fold in the substrate to position a first portion of the hardware section to extend along the protective bulk section, and a second fold in the substrate to position a second portion of the hardware section to extend along the first portion of the hardware section.

A board level shield includes shield walls forming a shield chamber sized and shaped to receive an electrical component mounted to a host circuit board. The shield walls provide electrical shielding entirely around the shield chamber for the electrical component. The shield walls extend between a top and a bottom configured to be mounted to the host circuit board and connected to a ground layer of the host circuit board. The board level shield includes a shield opening at the top bounded by the shield walls and sized and shaped to receive a thermal bridge to allow the thermal bridge to extend through the shield opening to interface with the electrical component. The board level shield includes shield fingers extending from the shield walls into the shield opening. The shield fingers are configured to engage the thermal bridge at separable mating interfaces to electrically connect the shield fingers to the thermal bridge.

A board level shield includes shield walls forming a shield chamber sized and shaped to receive an electrical component mounted to a host circuit board. The shield walls provide electrical shielding entirely around the shield chamber for the electrical component. The shield walls extend between a top and a bottom configured to be mounted to the host circuit board and connected to a ground layer of the host circuit board. The board level shield includes a shield opening at the top bounded by the shield walls and sized and shaped to receive a thermal bridge to allow the thermal bridge to extend through the shield opening to interface with the electrical component. The board level shield includes shield fingers extending from the shield walls into the shield opening. The shield fingers are configured to engage the thermal bridge at separable mating interfaces to electrically connect the shield fingers to the thermal bridge.

A cage includes a housing and a partition assembly mounted in the housing and separating an inner space of the housing into an upper space and a lower space. The partition assembly includes a first support plate and a second support plate arranged horizontally, and at least a pair of support frames disposed between the first support plate and the second support plate to separate the first support plate from the second support plate by a predetermined height. The support frames have a plurality of through holes. The support frames are formed by bending a front end of one of the first support plate and the second support plate.