TES CO., LTD

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Specialized cleaning techniques and apparatus designed for removing microscopic contaminants, residues, or films from sensitive substrates, such as semiconductor wafers or flat panel displays, often involving chemical, mechanical, or plasma-based methods.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.

Systems and processes for applying coatings, films, or materials onto surfaces in manufacturing or industrial contexts, often involving automated movement, surface preparation, or post-application treatment.

Techniques and structural designs for fabricating the physical layers of an OLED display, including material deposition, patterning, and methods to protect the active organic layers from environmental degradation like moisture and oxygen.

Application of protective layers to improve the durability and longevity of components by enhancing resistance to wear, oxidation, or chemical degradation in demanding operational environments.

Abrasive slurry compositions used in semiconductor manufacturing for planarizing wafer surfaces, typically containing abrasive particles and chemical additives to achieve specific material removal rates and selectivity.

Methods and structures for incorporating touch sensing capabilities directly into OLED display panels, typically involving conductive layers and insulating layers within or on top of the display stack.