Company patents
TIANJIN SANAN OPTOELECTRONICS CO., LTD.
TIANJIN SANAN OPTOELECTRONICS CO., LTD. shows a surprising shift in its patent strategy, with a significant decline in its core LED & Optoelectronics (Legacy CPC) category, which constitutes 63.9% of its portfolio, experiencing an 81.2% drop in 2025 and a 100.0% decline so far in 2026. This contrasts with a new focus on Light-Emitting Devices (LEDs), which emerged with 15 patents in 2025, suggesting a refinement rather than an abandonment of its display sector expertise.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
72 US filings (since 2023) · 5 categories · 11 themes
Innovations in the internal design of individual light-emitting diode chips or packages, focusing on semiconductor layer arrangements, electrode configurations, reflective elements, and light extraction features.
Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.
Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.
Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.
Focuses on novel semiconductor materials, heterostructures, and doping profiles to improve photovoltaic conversion efficiency, stability, and spectral response.
Specialized design and fabrication of light-emitting diodes specifically engineered to produce light in the deep ultraviolet (DUV) spectrum, often for applications like sterilization or curing.
LED devices and display systems designed to emit or utilize light across different spectral ranges, including visible and invisible light, or to create specific illumination patterns and immersive lighting experiences.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Focuses on advanced pixel architectures, often involving vertical stacking (3D) or silicon-on-insulator (SOI) structures, to improve performance, density, or functionality of photodiodes, transistors, and floating diffusion regions within image sensor pixels.
Systems that incorporate solar panels as a primary or auxiliary power source for various applications, including visual displays, remote devices, and portable battery charging, often emphasizing efficiency and adaptability.
Methods and components for electrically connecting photovoltaic cells within a module and ensuring long-term reliability, including busbar designs, bypass diodes, and flexible module assembly techniques.
Patents
Showing 1-1 of 1
PV Module Interconnection & Reliability