TOKYO SEIMITSU CO., LTD.

A measuring head 80 includes a rocking fulcrum member configured to support an arm member 83 having a tip end to which a contactor 85 is attached, the measuring head 80 detecting an amount of movement of the contactor 85 by detecting an amount of movement of the arm member 83 making a seesaw motion, in which the rocking fulcrum member is configured as a cross-shaped spring 10 with a cross-shaped thin plate part 10 - 1 , the cross-shaped spring 10 having a hole to penetrate a center part 10 - 3 of the cross-shaped spring 10 . With the measuring head, the same deformation can be obtained in a measuring direction with a smaller load, the torsional load in the other direction has sufficient rigidity, the fulcrum center is not shifted, and the repetition accuracy is improved.

An adjustment method for a shape measuring device that radiates light from a light source to a master for adjustment and a reference surface respectively as measurement light and reference light and measures a shape of a surface to be measured of a measurement target using multiplexed light of the measurement light and the reference light respectively reflected by the master for adjustment and the reference surface, the adjustment method including; measuring the master for adjustment in an adjusted state in which a focus position matches an interference position and calculating and storing a matching degree parameter indicating a matching degree between the focus position and the interference position as an adjustment matching degree parameter; when the measurement target is measured, measuring the master for adjustment, calculating the matching degree parameter and comparing the matching degree parameter with the adjustment matching degree parameter, to confirm the matching degree.

The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.

A pneumatic cylinder type retraction mechanism includes a cylinder and a piston movable back and forth inside the cylinder, and causes the piston to move back and forth using an air pressure. In this retraction mechanism, sealing means is provided as stationary sealing means on an inner periphery of the cylinder facing an outer periphery of the piston. The sealing means suppresses leakage of pressurized air for actuating the piston from within the cylinder. The retraction mechanism having this characteristic is capable of achieving at least one of effects including reduction in starting resistance, improvement of measurement accuracy of a measuring device or shortening of measurement time.

A tape affixing apparatus and a tape magazine capable of automatically switching or replacing a dicing tape. An affixing apparatus 3 includes a base section 31 on which a tape magazine 4 accommodating a dicing tape DT wound in a roll shape with a part of the dicing tape DT reeled out is installed to be replaceably mountable, movable guide rollers 32 a and 32 b , fixed guide rollers 33 a and 33 b , and a knife plate 35 that are movable to regulate a reel-out region R where the part of the dicing tape DT is reeled out to a predetermined track.

A probe includes: a light incidence/emission portion (cable tip surface) that emits measuring light and receive its reflected light; an optical splitting element (beam splitter) including a first surface a second surface, and a third surface, the optical splitting element (beam splitter) optically splitting the measuring light incident on the first surface from the light incidence/emission portion so as to emit a portion thereof from the second surface, optically splitting the reflected light incident on the second surface so as to emit a portion thereof from the first surface toward the light incidence/emission portion and to emit a remaining portion from the third surface; a light-receiving element that receives the reflected light emitted from the third surface; and a tip portion mounting portion (mounting shaft) that selectively mount either a first probe tip portion for non-contact measurement or a second probe tip portion for contact measurement.

A workpiece processing apparatus that prevents a processing capability of a processing apparatus from deteriorating due to a peeling unit that peels a protective sheet from a workpiece. A workpiece processing apparatus includes an affixing unit that affixes a dicing tape to a workpiece and a dicing frame, and a plurality of peeling units that peel a protective sheet previously affixed to the workpiece from the workpiece integrated with the dicing frame via the dicing tape.

A measurement device includes: a light source that emits multi-wavelength light; a first optical unit that introduces chromatic aberration into the multi-wavelength light along an optical axis; a second optical unit that focuses the multi-wavelength light into which the chromatic aberration has been introduced onto a measurement position of a measurement object; at least one dimming member that blocks a part of the multi-wavelength light incident on the first optical unit and that is arranged at a position intersecting the optical axis; a dimming adjustment unit that varies an area of the multi-wavelength light blocked by the at least one dimming member; an aperture portion that allows at least a part of the multi-wavelength light that has passed through the at least one dimming member, to pass therethrough; and a light receiver unit that acquires spectral information of the multi-wavelength light that has passed through the aperture portion.

A machining device acquires data including information regarding a machining condition of a workpiece and machines the workpiece under the machining condition recorded in the acquired data. The machining device includes: an irradiation unit configured to irradiate the workpiece with electromagnetic waves capable of transmitting through the workpiece; an imaging unit configured to image the workpiece irradiated with the electromagnetic waves; a preprocessing unit configured to generate a second image by executing preprocessing on a first image obtained by the imaging; and an image processing unit configured to execute image processing on the second image. The data acquired by the machining device includes information regarding a processing condition of the preprocessing. The preprocessing unit generates the second image by executing preprocessing on the first image under the processing condition recorded in the data.

Provided is a laser machining method of machining a second groove in a workpiece using a laser machining unit including a first machining unit capable of machining two first grooves in the workpiece by radiating a pair of laser beams to the workpiece to which a machining feed operation is relatively applied and two second machining units arranged on both sides of the first machining unit in a machining feed direction, the two second machining units being capable of machining an area between the two first grooves by radiating a laser beam between the two first grooves to be machined by the first machining unit. The second groove formed by hollowing out an area between the two first grooves is machined by applying a plurality of machining feed operations.