Company patents
TOKYO SEIMITSU CO., LTD.
TOKYO SEIMITSU CO., LTD. demonstrates a surprising shift in its patent strategy, with a strong emerging focus on Semiconductor Manufacturing Process, which saw a 300.0% YoY growth in 2024 and accounts for 19.1% of its portfolio, alongside a significant decline in Grinding & Polishing, which experienced a -100.0% YoY drop so far in 2026, indicating a shifting priority away from this area.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
110 US filings (since 2023) · 11 categories · 21 themes
Techniques and devices for measuring, monitoring, and controlling the surface topography, film thickness, or other characteristics of a workpiece during or after grinding/polishing to achieve specific finish requirements.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Techniques and systems for measuring three-dimensional shapes, depths, or surface profiles using optical principles, including diffraction, interferometry, structured light, and imaging.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Systems and methods for accurately measuring and compensating for position, orientation, and movement errors in mechanical systems, often for manufacturing, robotics, or optical alignment.
Techniques and systems utilizing laser beams for precise material modification, including cutting, cladding, ablation, and surface treatment, often for joining, shaping, or removing material.
Methods and apparatus for cleaning polishing pads, dressers, chamber components, or finished substrates to remove residues, debris, or contaminants, often involving specialized nozzles, fluids, or mechanical actions.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Specialized cleaning techniques and apparatus designed for removing microscopic contaminants, residues, or films from sensitive substrates, such as semiconductor wafers or flat panel displays, often involving chemical, mechanical, or plasma-based methods.
Apparatus and methods for automatically winding or unwinding continuous materials such as webs, cables, conduits, or yarns onto or from spools, reels, or bobbins, including aspects like layering, coreless winding, and material supply.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Design and application of abrasive tools and deburring heads tailored for specific geometries, materials, or access constraints, including flexible, expandable, or multi-component designs for precision finishing.
Systems and methods for precisely measuring, monitoring, and regulating the longitudinal tension in continuous webs of material during roll-to-roll processes to prevent defects, reduce waste, and ensure consistent product quality.
Integration of robotics, sensors, and control systems to automate the grinding, polishing, or deburring process, including workpiece handling, tool adjustment, and system maintenance for improved efficiency and precision.
Mechanisms and control systems for reliably feeding, conveying, and separating print media, including managing media roll changes, adjusting airflow, and adapting to different media characteristics.
Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.
Systems that perform operations like cutting, folding, binding, or applying liquids to sheets or webs, often integrated within larger production lines such as printing or image forming apparatuses.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Methods and devices that determine the position, angle, or distance of an object by detecting changes in magnetic fields or inductive coupling.
Patents
Showing 1-10 of 15
Post-Processing Cleaning & Conditioning