TSE CO., LTD.

A test socket including: a testing probe including a lower plunger in contact with a pad; an upper plunger coupled to the lower plunger; a spring probe made of a cylindrical spring for applying elasticity to the lower plunger and the upper plunger; and a contact probe with an upper side contacting a terminal of a test device and a lower side contacting the upper plunger; a socket housing that provides housing holes and accommodates the contact probe and the spring probe so that an upper side of the contact probe protrudes at each housing hole; and a cover that provides cover holes and is fastened to the socket housing so that a lower side of the lower plunger protrudes at each cover hole, wherein the upper plunger provides a sliding groove, the lower plunger provides a pair of sliding protrusions inserted into the sliding groove.

A method for manufacturing a multi-layer circuit board including an extreme fine that may include: providing a board having one surface on at least a part of which an upper conductive layer is formed and the other surface on at least a part of which a lower conductive layer is formed; forming a lower metal layer on the other surface of the board; forming a first resist layer on the one surface of the board through a photolithography process, and forming a first opening on the first resist layer; forming a metal pillar by plating the first opening by using an electrolytic plating method; removing the first resist layer; forming an insulating layer on a location from which the first resist layer is removed; and evenly polishing the metal pillar and the insulating layer.

A test device for a semiconductor package and provides a test device for a semiconductor package for enlarging a pick and place area of a lower package to an entire size of the lower package using a floating plate movably coupled to a pusher and having a silicon pad disposed between the pusher and the floating plate to be moveable by elasticity of the silicon pad.

The test socket according to the present disclosure is configured to bring terminals of a device under test into contact with electrode pads of a test board, that generates a test signal, to electrically connect the device under test and the tester, the contact part-module configured to allow the contact part to be in an aligned state is separatably coupled to an upper side of the second lower housing of the test socket, so it is possible to easily replace the contact part with new one without separating the test socket from the test board.

Disclosed are a chip socket assembly for semiconductor chip testing and a semiconductor chip testing apparatus including the same. The chip socket assembly includes a chip guide member having a chip guide hole through which a chip having a plurality of bumps and a plurality of pads formed on one surface thereof is inserted and guided, a bump guide member having at least one bump guide hole configured to guide the positions of at least some of the bumps and at least one pad exposure hole configured to expose at least some of the pads, an intermediate fastening member having an opening configured to expose at least a part of the one surface of the chip on which the bumps and the pads are formed, and a chip socket substrate provided on one surface thereof with a plurality of probes configured to contact at least some of the pads.

A lower plunger of a pogo pin according to the present disclosure includes a metal pin and an electro-conductive rubber, and the electro-conductive rubber having a configuration in which a plurality of electro-conductive particles are contained in an elastic insulating material is attached to a lower end of the metal pin to increase a contact area between the lower plunger and a pad of a test board through a surface contact, thereby preventing the occurrence of inductive spikes and thus improving signal quality in a high-speed signal transmission environment.

The present disclosure relates to a signal transmission connector having electro-conductive members supported by a support member and spaced apart from inner walls of housing holes formed in an upper housing and a lower housing, a rubber ring is disposed in a space between the electro-conductive member and the inner wall of each housing hole of the upper or lower housing, surrounds the electro-conductive member, and comes in contact with the inner wall of the upper or lower housing to align the electro-conductive member, so the shift contact between the terminal of the test device or the pad of the test board and the electro-conductive member are prevented and it is possible to prevent foreign substances from entering the inside of the signal transmission connector.

A signal transmission connector including a frame base in which a first through hole and a second through hole are alternately formed and a frame including a frame top plate having a third through hole at each position corresponding to the first through hole and covering a top surface of the frame base. A frame bottom plate having a fourth through hole at each position corresponding to the first through hole and covering a bottom surface of the frame base and a conductive part disposed on a conductive part hole including a first through hole, a third through hole, and a fourth through hole and being in the form of a plurality of conductive particles in the elastic insulating material, wherein the frame is made of an inelastic insulating material. An air layer is formed in the second through hole sealed by the frame top plate and the frame bottom plate.

Provided is a rubber socket having a structure with a built-in component. In the rubber socket with a built-in component, a connection sheet having components attached to an upper surface, a lower surface, or upper and lower surfaces of a conductive sheet composed of a conductive part and an insulating part is detachably coupled to the upper surface, the lower surface, or the upper and lower surfaces, and a guide sheet made of an inelastic insulating material is attached to an upper side, a lower side, or upper and lower sides of the connection sheet, and characteristics of a tester or a device to be tested may be tested using the components.

Disclosed is a test head including a probe located in the form of a pin from a semiconductor substrate toward a space converter, the probe having a displacement portion and an elastic portion located near the space converter and the semiconductor substrate, respectively, and a lower plate and an upper plate sequentially located in a longitudinal direction of the probe, the lower plate and the upper plate being configured to surround the displacement portion, wherein the probe has a “C” shape or an inverted “C” shape at the displacement portion.