TSE CO., LTD.

The objective of the present disclosure is to provide a semiconductor package test apparatus for testing a semiconductor package by means of connecting a semiconductor package and a test board. The test apparatus according to the present disclosure comprises: a conductive part mounted on a test board providing a test signal, formed at each of positions corresponding to a pad of the test board, and having a plurality of conductive particles aligned in a thickness direction in an elastic insulating material; a test socket made of an elastic insulating material and including an insulating part insulating the conductive part from another adjacent conductive part while supporting the conductive part; a multi-layer organic product closely disposed on the upper side of the test socket and having a lower land formed at each of positions corresponding to the conductive part, an upper land formed at each of positions corresponding to a terminal of the semiconductor package, and a wiring pattern connecting the lower land and the upper land formed in a substrate; and a pitch converter deposited on the upper land and having conductive contact pins contacting the terminals of the semiconductor package, wherein the lower end of the conductive part is connected to the pad of the test board, and the upper end of the conductive part is connected to the lower land, such that the semiconductor package and the test board having different pitches can be tested.