Yamaichi Electronics Co., Ltd.

Provided is a connector having: a top pin group 120 having a plurality of contact pins 121, 122 aligned in a predetermined direction; and a bottom pin group having a plurality of contact pins aligned in the predetermined direction in which the bottom pin group is arranged so as to face the top pin group 120 and located on a mount substrate side. Each of the contact pins 121, 122 is at least either one of a signal pin 122 used for signaling and a ground pin 121 used for grounding, and the top pin group 120 includes a double ground configuration in which sets each including two signal pins 122 aligned between two ground pins 121 are aligned adjacent to each other in the predetermined direction.

Provided is a connector that can achieve improvement in strength, improvement in shape accuracy, a reduction in the number of components, and a reduction in the number of steps required for assembly. A connector for connecting an external substrate and an external cable to each other includes: a metal casing having a ground terminal part electrically connected to and fitted into an external substrate-side connector mounted to the substrate and a fitting part into which the cable is fitted, and the ground terminal part and the fitting part are integrally formed.

A connector assembly in which ground paths between cables and a paddle card are formed and of which the size can be reduced is provided. A connector assembly includes a ground member including a plurality of partitioning members made of metal, each of which has a U-shape, and a metal plate to which the partitioning members are fixed. The ground member is configured such that the partitioning members are arranged at a pitch twice a predetermined pitch in a width direction of the connector assembly, so that partition walls of the partitioning members are arranged at the predetermined pitch in the width direction of the connector assembly. The ground shields are electrically connected to the ground member in a state where ground shields exposed from insulating films of the cables are disposed between the partition walls.

An embodiment includes a main body holding pin groups and partition walls partitioning adjacent signal pins from each other, each of the signal pins has a fixing part located on a mount part side and fixed to a substrate, tip parts located on an insertion-extraction part side and serving as a free end, and a contact part provided between the fixing part and the tip parts and configured to be in electrical contact with electrodes of a device, and the adjacent tip parts are located via an opening.

According to an embodiment, high-frequency signal transmission device includes a connector and a wiring board with two cable ends. The connector includes contact terminals with signal contact terminals and ground contact terminals. In a wiring board, signal contact pads, ground contact pads and one or more ground layers are formed on at least one of the cable ends. The ground contact terminal includes an arm portion bent so as to locally abut against the ground contact pad at a contact portion. The contact portion of the arm portion is positioned so as to (i) at least partially abut against a surface of a covering portion of the ground contact pad covering the first penetrating electrode directly above the first penetrating electrode, or (ii) abut against the ground contact pad near an outer periphery of the covering portion, when the wiring board is electrically connected to the connector.

A plug connector inserted in or extracted from a receptacle connector includes a casing and a lever member attached to the casing. The lever member has a fulcrum part supported pivotably to the casing, an engaging part that is located closer to the receptacle connector than the fulcrum part in an insertion-extraction direction and that can engage with an engaged part of the receptacle connector, and an operating part that is located on the opposite side from the receptacle connector with respect to the fulcrum part in the insertion-extraction direction and that, when pressed, can release the engaging part from engagement with the engaged part.

High-frequency signal transmission cable includes: a dielectric layer; and first and second wiring layers arranged to sandwich the dielectric layer. The first wiring layer includes at least M (M indicating a natural number of 2 or more) differential transmission lines. The first wiring layer further includes a group of first ground lines including at least 2×M first ground lines. The second wiring layer includes a group of second ground lines including at least M second ground lines. The group of first ground lines are allocated to the M differential transmission lines in accordance with a condition of at least two first ground lines per one differential transmission line in non-overlap manner, and the group of second ground lines are allocated to the M differential transmission lines in accordance with a condition of at least one second ground line per one differential transmission line in non-overlap manner. Each of the differential transmission lines is interposed between the at least two first ground lines and is opposed to the at least one second ground line.

A connector that is mounted on an external mount substrate and in or from which an external pluggable substrate is inserted or extracted in an insertion-extraction direction Die includes: pin groups each including a plurality of aligned contact pins; an outer housing holding the pin groups and a frame attached to the outer housing. The outer housing has a main body and a protruding part which protrudes in the insertion-extraction direction Die from the main body and in which a slot opening in or from which the pluggable substrate is inserted or extracted is formed. The frame surrounds the whole circumference of the protruding part and is installed on an installation surface of the main body substantially orthogonal to the insertion-extraction direction Die.

According to an embodiment, a high-speed transmission device includes a substrate, a control device on the substrate, a first connector, a second connector; and a cable assembly between the first connector and the second connector. The first connector is disposed at a position near the control device on the substrate and electrically connected to the control device via the substrate. The second connector is disposed at a position away from the control device on the substrate and equipped with an apparatus for transmitting/receiving a signal to and from the control device. The cable assembly includes a cable row, a paddle card substrate and a first conductive resin cover. Cables each transmitting a differential signal are arranged side by side in the cable row. The cables each comprise an internal conductor and an external conductor.

According to an embodiment, a high-speed transmission device includes a substrate, a control device on the substrate, a first connector, a second connector; and a cable assembly between the first connector and the second connector. The first connector is disposed at a position near the control device on the substrate and electrically connected to the control device via the substrate. The second connector is disposed at a position away from the control device on the substrate and equipped with an apparatus for transmitting/receiving a signal to and from the control device. The cable assembly includes a cable row, a paddle card substrate and a first conductive resin cover. Cables each transmitting a differential signal are arranged side by side in the cable row. The cables each comprise an internal conductor and an external conductor.