Yamaichi Electronics Co., Ltd.

Provided are a contact pin and a socket for inspection that can improve contact reliability to an IC package. An embodiment includes: an electrically conductive electrical contact extending from a base end to a tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive thermal contact extending from a base end to a tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip, and the electrical contact and the thermal contact are laterally stacked adjacent to each other and are movable independently of each other.

Provided is a heat sink unit that is less likely to damage a package and has excellent handleability. The heat sink unit 1 includes a base 90, a cover 20, a first lever 80, a third lever 50, and a heat sink 30. The first lever 80 is rotatably held by the base 90, carries the heat sink 30 and a heat sink pedestal 40, and is hard stopped at the base 90 by an end portion of the first lever 80. The third lever 50 is rotatably held by the cover 20, is connected to the first lever 80 to open and close the same, and controls up-and-down movements of the heat sink pedestal 40 by a tip end of the third lever 50. The heat sink 30 is configured to press the IC package 100 with timing shifted by a long hole of the third lever 50 after the first lever 80 is hard stopped at the base 90.

Provided are a contact pin and a socket for inspection that can improve electrical performance or thermal performance. An embodiment includes: an electric conductive electrical contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; an electric conductive thermal contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive casing that bundles the electrical contact and the thermal contact laterally stacked adjacent to each other, and the casing is in contact with the electrical contact and the thermal contact so as to form a path bypassing the elastic deformation part.

Provided are a contact pin and a socket for inspection that can improve contact reliability to an IC package. An embodiment includes: an electrically conductive electrical contact extending from a base end to a tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive thermal contact extending from a base end to a tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip, and the electrical contact and the thermal contact are laterally stacked adjacent to each other and are movable independently of each other.

The present invention provides a heat sink unit that has a small mounting area and high radiating efficiency without breaking or damaging the IC package. The heat sink unit includes a base, a heat sink, a unit base, a heat sink mount, a frame member, a first lever, and a second lever. When the frame member 6 reaches a confronting position, further rocking is restricted, the heat sink mount supported by the frame member moves downward, and the end surface of the heat sink supported by the heat sink mount comes into contact with the IC package.

Provided is a socket for inspection that can correct inclination of a terminal in contact with a device under inspection to stabilize the terminal-to-electrode contact. The socket includes: a contact terminal having a barrel with a flange, a device side terminal, a test board side terminal, and a spring; a housing having a stepped hole through which the contact terminal is inserted and in which a step that abuts against the flange is axially formed; and a movable pedestal provided so as to move closer to and away from the housing and having a receiving hole through which a distal end side of the device side terminal projecting from the barrel is inserted and which receives an electrode of the device. A guide part whose inner diameter is substantially the same as the outer diameter of a projecting portion of the device side terminal is formed in the receiving hole.

Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat ( 12 ) that has an attachment surface ( 12 a ) to which an image sensor ( 60 ) is attached; a base ( 10 ) that has a placement surface ( 10 b ) on which the seat ( 12 ) is placed and a secured surface ( 10 a ) located on an opposite side of the placement surface ( 10 b ) and secured to an inspection substrate; and a lid member ( 18 ) that does not come into contact with the image sensor ( 60 ) and that covers a back surface region ( 80 ) on a side of a back surface ( 64 ) of the image sensor ( 60 ) when the image sensor ( 60 ) is attached to the seat ( 12 ).

Provided is a Kelvin contact for inspection in which contacts and an insulating layer are less likely to be shifted relative to each other even after repeatedly performed Kelvin inspection. The Kelvin contact for inspection includes: a first contact having an upper contact point that comes into contact with one electrode terminal of an IC device and a lower contact point that comes into contact with an electrode pad of a substrate for inspection; and a second contact having an upper contact point that comes into contact with the one electrode terminal and the lower contact point that comes into contact with an electrode pad of the substrate for inspection. The first and second contacts are adjacently arranged to contact with the same one electrode terminal and provided with an insulating layer surrounding the entire main body area except upper and lower contact point areas including the upper and lower contact points, respectively.

An IC socket ( 2 ) includes a first contact terminal ( 15 a ) that contacts a gull wing type lead terminal ( 1 b ) of an IC device ( 1 ), a second contact terminal that contacts a J-type lead terminal, a cam portion ( 3 d ) and a sliding portion ( 15 c 5 ) for bringing the first contact terminal ( 15 a ) into contact with the gull wing type lead terminal ( 1 b ), and a latch ( 6 ) for bringing the second contact terminal into contact with the J-type lead terminal. An asynchronous operation in which a contact operation by the cam portion ( 3 d ) and the sliding portion ( 15 c 5 ) is performed after a contact operation by the latch ( 6 ) is performed.

The contact probe comprises a barrel 50 , an inspection device side terminal 60 , a test board side terminal 70 , and a spring 80 disposed in a state of being in contact with the test board side terminal 70 and the inspection device side terminal 60 , the test board side terminal 70 includes a stop portion 74 that can abut on the caulked portion 52 in the barrel 50 and a terminal body that projects from the other end 56 of the barrel 50 , and the terminal body includes, in order from a tip end, a first shaft section 71 , a second shaft section 72 having a diameter larger than a diameter of the first shaft section 71 , and a third shaft section 73 having a diameter smaller than the diameter of the second shaft section 72 and having at least a part that can be housed in the barrel 50.