Patent Theme

3D Image Sensor Pixel Design

Focuses on advanced pixel architectures, often involving vertical stacking (3D) or silicon-on-insulator (SOI) structures, to improve performance, density, or functionality of photodiodes, transistors, and floating diffusion regions within image sensor pixels.

8,405 US filings from 772 companies since 2023 · 2023: 2,056 · 2024: 2,493 · 2025: 2,673 · 2026 YTD: 1,183

Photovoltaic / Photoconductive Devices

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.