Patent Theme

Device Enclosure & Material Engineering

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

7,045 US filings from 1,639 companies since 2023 · 2023: 1,726 · 2024: 2,195 · 2025: 2,169 · 2026 YTD: 955

Hardware Platform (Cooling, Power, Packaging)Printed Circuits & Electronic Assemblies

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#CompanySince 20232023202420252026 YTDYoY
1SAMSUNG ELECTRONICS CO., LTD.51312514516875+15.9%
2Apple Inc.30992979228-5.2%
3Samsung Display Co., Ltd.27071718345+16.9%
4DELL PRODUCTS L.P.21656607228+20.0%
5InnoLux Corporation12636324810+50.0%
6HONOR DEVICE CO., LTD.1187414327+4.9%
7CORNING INCORPORATED932837226-40.5%
8COMMSCOPE TECHNOLOGIES LLC922829323+10.3%
9INTEL CORPORATION879292722-6.9%
10Huawei Technologies Co., Ltd.8516292713-6.9%
11LENOVO (SINGAPORE) PTE. LTD.8212243115+29.2%
12Murata Manufacturing Co., Ltd.652221175-19.0%
13QUANTA COMPUTER INC.6315201612-20.0%
14Wistron Corporation541815183+20.0%
15HITACHI ASTEMO, LTD.53820214+5.0%
16Getac Technology Corporation481611174+54.5%
17ADVANCED SEMICONDUCTOR ENGINEERING, INC.451213146+7.7%
18WISTRON CORP.451319112-42.1%
19AGC Inc.441311155+36.4%
20GOOGLE LLC441313126-7.7%
21Fulian Precision Electronics (Tianjin) Co., LTD.439141460.0%
22LG ELECTRONICS INC.41615146-6.7%
23International Business Machines Corporation40141394-30.8%
24Panasonic Intellectual Property Management Co., Ltd.40111568-60.0%
25BOE Technology Group Co., Ltd.39913116-15.4%