Temporary Wafer Bonding & Debonding

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

5,574 US filings from 1,099 companies since 2023 · 2023: 1,511 · 2024: 1,732 · 2025: 1,794 · 2026 YTD: 537

Chip-to-Chip Interconnect (Bonding, Bumps)Semiconductor Manufacturing Process

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#	Company	Since 2023	2023	2024	2025	2026 YTD	YoY
1	Taiwan Semiconductor Manufacturing Company, Ltd.	269	58	89	99	23	+11.2%
2	DISCO CORPORATION	257	73	73	92	19	+26.0%
3	TOKYO ELECTRON LIMITED	235	51	66	92	26	+39.4%
4	Taiwan Semiconductor Manufacturing Co., Ltd.	210	51	74	75	10	+1.4%
5	SAMSUNG ELECTRONICS CO., LTD.	170	39	47	64	20	+36.2%
6	Applied Materials, Inc.	132	29	46	44	13	-4.3%
7	Adeia Semiconductor Bonding Technologies Inc.	116	29	36	34	17	-5.6%
8	NITTO DENKO CORPORATION	112	37	41	21	13	-48.8%
9	Resonac Corporation	82	7	22	38	15	+72.7%
10	3M Innovative Properties Company	75	22	20	27	6	+35.0%
11	INTEL CORPORATION	72	16	25	29	2	+16.0%
12	TEXAS INSTRUMENTS INCORPORATED	72	26	20	20	6	0.0%
13	Taiwan Semiconductor Manufacturing Company Limited	69	14	22	28	5	+27.3%
14	Micron Technology, Inc.	64	9	26	24	5	-7.7%
15	NGK INSULATORS, LTD.	61	19	17	22	3	+29.4%
16	NISSAN CHEMICAL CORPORATION	59	10	15	20	14	+33.3%
17	CANON KABUSHIKI KAISHA	57	8	18	25	6	+38.9%
18	Kulicke and Soffa Industries, Inc.	52	17	12	23	·	+91.7%
19	Infineon Technologies AG	49	21	12	10	6	-16.7%
20	Lam Research Corporation	49	14	13	19	3	+46.2%
21	Tesa SE	48	9	23	8	8	-65.2%
22	Kioxia Corporation	46	19	16	7	4	-56.2%
23	LINTEC CORPORATION	44	13	6	17	8	+183.3%
24	Soitec	43	13	16	11	3	-31.2%
25	ASM IP Holding B.V.	42	13	10	16	3	+60.0%