Company patents
KABUSHIKI KAISHA NIHON MICRONICS
KABUSHIKI KAISHA NIHON MICRONICS' patent strategy is overwhelmingly concentrated in Electrical Measurement, which accounts for 71.1% of its portfolio and shows robust growth, with a 57.1% increase in patents so far in 2026. Surprisingly, despite its focus on electronics, the company has seen a complete decline in patenting for Semiconductor Testing and Optical Elements & Systems, both dropping to zero patents in 2025 and 2026 respectively, indicating a significant shift away from these areas.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
76 US filings (since 2023) · 9 categories · 9 themes
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Integration of dedicated physical structures or built-in circuitry within semiconductor devices to enable characterization of process variations, material properties, electrical leakage, or device performance.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Techniques and apparatus for measuring and verifying the performance, properties, and structural integrity of optical components like lenses, waveguides, and optical fibers. This includes loss, refractive index, and physical defects.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Patents
Showing 1-10 of 11
Cable Termination & Management