KABUSHIKI KAISHA NIHON MICRONICS

An optical probe for transmitting an optical signal to, and receiving an optical signal from, an optical device, includes: a tip surface that is a convex curved surface and faces the optical device; an optical waveguide that is a refractive index distribution type and has a first end part connected to the tip surface; and a base end surface to which a second end part of the optical waveguide is connected.

An optical probe includes a medium through which an optical signal propagates; a plano-convex first lens disposed on a first surface of the medium with a bottom surface facing the medium; and a plano-convex second lens which constitutes a compound lens in which a bottom surface of the second lens is connected to the bottom surface of the first lens by aligning an optical axis of the second lens and an optical axis of the first lens. The second lens is embedded in the medium and has a curvature radius of a convex surface larger than that of the first lens. A refractive index of the medium is larger than a refractive index of the compound lens.

A measurement system includes a drive device configured to drive the plurality of optical semiconductor elements, a probe unit including a plurality of optical connection devices configured to receive respective emitted lights from the plurality of optical semiconductor elements and a processing device including a plurality of photoelectric converters. Each of the optical connection devices is connected to each of the photoelectric converter, and at least some of the emitted lights received by the optical connection devices are input to the photoelectric converter. The photoelectric converter converts the input emitted lights into electric signals.

A measurement system includes an optical probe array including the m-number of optical probe groups arranged, each including the n-number of optical probes, the m-number of optical signal selectors each corresponding one of the optical probe groups, and a control circuit configured to control the optical signal selectors. The respective optical signal selectors select and output one of optical signals output from the n-number of the optical probes of the corresponding optical probe groups. The measurement system causes the control circuit to control the optical signal selectors to repeat the selection of the optical signals until the optical signals output from all of the optical probes included in the respective optical probe groups are selected.

An optical probe includes a first region and a second region connected to have a continuous optical waveguide in which a transmission mode is a single mode. The first region connected to a tip-end surface opposed to an optical device includes a region in which a mode field diameter that is maximum at the tip-end surface is gradually decreased toward a boundary between the first region and the second region. The tip-end surface is a curved surface and has a radius of curvature set so that an advancing direction of an optical signal entering through the tip-end surface approximates in parallel to a central-axis direction of the optical waveguide.

A measurement method of receiving an emission light output from an optical semiconductor element on an incident end surface of an optical probe, shifts a relative position between the optical semiconductor element and the optical probe on a plane surface intersecting with an optical axis of the emission light, measures an incident intensity of the emission light at several positions, and obtains an incident intensity pattern showing a relationship between a change in the relative position and the respective incident intensities.

[Problem] To allow to condense and guide the light emitted by a light emitting element having a large light emission surface to an optical connector, in inspection of a semiconductor integrated circuit. [Solution] The present disclosure provides a connecting apparatus used at the time of inspection of a semiconductor integrated circuit, and the connecting apparatus includes an electric connector electrically connecting to an electrode terminal of the semiconductor integrated circuit, an optical connector optically connecting to an optical terminal of the semiconductor integrated circuit, a connector support substrate configured to support the electric connector and the optical connector so that an end part of the electric connector and an end part of the optical connector respectively connect to the semiconductor integrated circuit, and a light condensing substrate configured to condense light emitted by an optical terminal of the semiconductor integrated circuit to the optical connector.

An optical probe receives an optical signal output from a test subject. The optical probe includes an optical waveguide composed of a core portion and a cladding portion disposed on an outer periphery of the core portion, wherein an incident surface of the optical waveguide, which receives the optical signal, is a convex spherical surface with a constant curvature radius.

A connecting device for inspection includes optical probes, and a probe head including a plurality of guide plates. The probe head includes a first guide plate, and a second guide plate arranged movably with respect to the first guide plate in a radial direction of the penetration holes in a state in which the optical probes are inserted to the respective penetration holes. The probe head holds the optical probes by inner wall surfaces of the penetration holes of the first guide plate and inner wall surfaces of the penetration holes of the second guide plate in a state in which the positions of the central axes of the penetration holes of the first guide plate are shifted in the radial direction from the positions of the central axes of the penetration holes of the second guide plate.

[Problem] To allow to condense and guide the light emitted by a light emitting element having a large light emission surface to an optical connector, in inspection of a semiconductor integrated circuit. [Solution] The present disclosure provides a connecting apparatus used at the time of inspection of a semiconductor integrated circuit, and the connecting apparatus includes an electric connector electrically connecting to an electrode terminal of the semiconductor integrated circuit, an optical connector optically connecting to an optical terminal of the semiconductor integrated circuit, a connector support substrate configured to support the electric connector and the optical connector so that an end part of the electric connector and an end part of the optical connector respectively connect to the semiconductor integrated circuit, and a light condensing substrate configured to condense light emitted by an optical terminal of the semiconductor integrated circuit to the optical connector.