Company patents

Ulvac, Inc.

Ulvac, Inc. demonstrates a dynamic patent strategy, with a surprising recent surge in Organic Electronics (OLED), which accounts for 8.0% of its portfolio with all 6 patents filed so far in 2026, indicating a strong emerging focus. While Coating & Surface Treatment remains its largest category at 56.0% of the portfolio, the significant decline in Electron / Ion Tubes & Discharge (YoY -62.5% so far in 2026) and Semiconductor Manufacturing Process (YoY -33.3% so far in 2026) suggests a shifting priority away from some traditional semiconductor areas.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

75 US filings (since 2023) · 8 categories · 17 themes

Plasma Process Chamber Engineering

Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.

Electron / Ion Tubes & Discharge
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16since 2023
0.0%YoY
Advanced Deposition Chamber Hardware

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Coating & Surface Treatment
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15since 2023
-75.0%YoY
Conformal & Selective Film Deposition

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Coating & Surface TreatmentSemiconductor Manufacturing Process
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14since 2023
-25.0%YoY
Advanced Etching & Patterning Control

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Semiconductor Manufacturing Process
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13since 2023
+50.0%YoY
Wafer Handling and Process Environment Control

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Semiconductor Manufacturing Process
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10since 2023
-83.3%YoY
Display Panel Manufacturing & Encapsulation

Techniques and structural designs for fabricating the physical layers of an OLED display, including material deposition, patterning, and methods to protect the active organic layers from environmental degradation like moisture and oxygen.

Organic Electronics (OLED)
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9since 2023
+1500.0%YoY
RF Plasma Power Delivery

Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.

Electron / Ion Tubes & Discharge
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7since 2023
0.0%YoY
Solid-State Battery Manufacturing

Process and equipment for producing solid-state battery cells, including solid electrolyte synthesis (sulfide/oxide/polymer), thin-film deposition, lamination, sintering, dry-electrode fabrication, and stacking under controlled atmosphere.

Batteries & Fuel Cells
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4since 2023
+100.0%YoY
Vacuum System & Chamber Evacuation

Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.

Electron / Ion Tubes & Discharge
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4since 2023
n/a
Battery Electrode Coating & Slurry

Slurry compositions and coating processes for battery electrodes, including binder/active-material slurries, surface coating layers, and electrode-to-foil adhesion for cathode and anode.

Batteries & Fuel Cells
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3since 2023
new
Flexible/Foldable Device Structures

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.

Organic Electronics (OLED)
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2since 2023
new
Specialized End-Effectors & Mechanisms

Design and control of advanced robotic grippers, tools, and mechanical linkages for specific manipulation tasks or operating in challenging environments.

Manipulators & Robotics
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2since 2023
n/a
Advanced Memory Cell Structures

Focuses on the physical design, materials, and manufacturing processes for individual memory cells, including transistor structures, interconnects, and multi-layered (3D) architectures to enhance density and performance.

Memory Devices (Structural)
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2since 2023
n/a
Lithium Battery Anode Materials

Active anode materials and manufacturing techniques for rechargeable lithium-ion batteries, including silicon-carbon composites, graphite, lithium-metal anodes, and electrode coating processes that improve capacity, cycle life, and rate capability.

Batteries & Fuel Cells
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1since 2023
new
Charged Particle Beam Optics

Techniques and devices for generating, shaping, focusing, and deflecting electron or ion beams, often involving multi-pole lenses, deflectors, and aberration correction for applications like microscopy or processing.

Electron / Ion Tubes & Discharge
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1since 2023
n/a
Ion Implantation Control & Metrology

Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.

Electron / Ion Tubes & Discharge
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1since 2023
n/a
Resistive & Phase Change Memory

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Memory Devices (Structural)
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1since 2023
n/a

Patents

Showing 171-180 of 180

Page 18 of 18
US 20210036186 A1APPLICATION
H01L33/10

DEEP ULTRAVIOLET LED AND METHOD FOR PRODUCING THE SAME

Filed:2019-01-25Pub:2021-02-04
Applicant:MARUBUN CORPORATION

A deep ultraviolet LED with a design wavelength λ, including a reflecting electrode layer (Au), a metal layer (Ni), a p-GaN contact layer, a p-block layer made of a p-AlGaN layer, an i-guide layer made of an AlN layer, a multi-quantum well layer, an n-AlGaN contact layer, a u-AlGaN layer, an AlN template, and a sapphire substrate that are arranged in this order from a side opposite to the sapphire substrate, in which the thickness of the p-block layer is 52 to 56 nm, a two-dimensional reflecting photonic crystal periodic structure having a plurality of voids is provided in a region from the interface between the metal layer and the p-GaN contact layer to a position not beyond the interface between the p-GaN contact layer and the p-block layer in the thickness direction of the p-GaN contact layer, the distance from an end face of each of the voids in the direction of the sapphire substrate to the interface between the multi-quantum well layer and the i-guide layer satisfies λ/2n 1Deff (where λ is the design wavelength and n1Deff is the effective average refractive index of each film of the stacked structure from the end face of each void to the i-guide layer) in the perpendicular direction, the distance being in the range of 53 to 57 nm, the two-dimensional reflecting photonic crystal periodic structure has a photonic band gap that opens for TE polarized components, and provided that the period a of the two-dimensional reflecting photonic crystal periodic structure satisfies a Bragg condition with respect to light with the design wavelength λ, the order m of a formula of the Bragg condition: mλ/n 2Deff =2 a (where m is the order, λ is the design wavelength, n 2Deff is the effective refractive index of two-dimensional photonic crystals, and a is the period of the two-dimensional photonic crystals) satisfies 2≤m≤4, and the radius of each void is R, R/a satisfies 0.30≤R/a≤0.40.