Yamaichi Electronics Co., Ltd.

Provided are a receptacle assembly and a circuit board in which routing of internal layer wirings is taken into consideration. Some of the plurality of first internal layer wirings 134 are drawn toward the second electrode line L 2 when viewed in the depth direction Dd, and some of the plurality of second internal layer wirings 134 are drawn toward the first electrode line L 1 when viewed in the depth direction Dd.

Provided are a relay device and a connector assembly that can electrically connect a connector and an external circuit board to each other without using terminals bent at a right angle. A relay device configured to electrically connect a plurality of contact pins to a plurality of cables and a host board includes a paddle board and a connection part, the paddle board electrically connects some of the plurality of contact pins to the plurality of cables, the connection part has a plurality of press-fit pins, and the plurality of press-fit pins electrically connect the paddle board to the host board.

Provided is a connector in which a housing is reinforced in order to suppress deformation of the housing and thus realize good contact performance of contact pins. Outer housings 110, 110 ′ each have a base part 111 , an intermediate part 112 , and a tip part 113 from the circuit board 20 side along the depth direction Dd, the base part 111 includes a bottom face 111 a facing a circuit board 20 , the tip part 113 includes a slot opening 113 a configured to accept a module board 11 inserted, the intermediate part 112 includes a smaller dimension in the width direction Dw and/or a smaller dimension of the height direction Dh than the base part 111 and the tip part 113 , and a frame 170 , a second frame 180 , and a frame 190 each are an annular plate having four sides surrounding the intermediate part 112.

Provided are a cage assembly and a receptacle assembly that can efficiently cool a heat sink. An embodiment includes: a cage 100 configured to house an optical module 310; and a heat sink 50 configured to thermally contact with the optical module 310, the cage 100 has a port wall 110 defining a port Sp in which the optical module 310 is housed, a first adjacent wall 120 defining a first adjacent space S 1 that is adjacent to the port Sp in the second direction, and a second adjacent wall 130 defining a second adjacent space S 2 that is adjacent to the port Sp in the third direction and in which the optical module 310 is not housed, and the heat sink 50 is housed in the first adjacent space S 1.

A connector ( 7 ) includes: a first connector part ( 10 ) having a first module side connection part connected to one end of an OSFP module in the front (F), having a first substrate side connection part connected to a substrate, and installed on the substrate; a second connector part ( 20 ) provided at a position such that the first module side connection part is interposed between the substrate and the second connector part ( 20 ), having a second module side connection part connected to one end of an OSFP module at the front (F), having a second substrate side connection part connected to the substrate, and stacked on the first connector part ( 10 ); and an intermediate part ( 30 ) provided between the first connector part ( 10 ) and the second connector part ( 20 ), and a cooling flow path in which air flows from the front (F) side toward the rear (R) side of the connector ( 7 ) is formed in the intermediate part ( 30 ).

A socket includes a housing and a plurality of contacts. The housing is formed in a box-shape with an opening and is provided with a matrix of through holes at a bottom portion. The plurality of contacts includes ground contacts and signal contacts which are arranged so as to be aligned alternately in a predetermined array direction by one or a plurality of them and are passed through the through holes. The ground contacts adjacent to each other in the array direction are short-circuited.

Cable device ( 9 ) includes a flexible cable ( 2 ) including a plurality of cable-strips ( 35 ) formed in accordance with one or more slits ( 21 ), and one or more bundling members ( 5 ) for bundling the plurality of cable-strips ( 35 ) into a stacked state. The plurality of cable-strips ( 35 ) includes two or more signal transmission strips ( 35 s ) each of which includes at least one high-frequency signal transmission line. The cable device ( 9 ) further includes a spacer ( 80 ) interposed between the signal transmission strips ( 35 s ) in a stacking direction of the cable-strips ( 35 ) in at least one or more bundling locations by the one or more bundling members ( 5 ).

According to an embodiment, a cable assembly arranged between a first connector and a second connector is disclosed. The first connector is arranged at a position near a control device on a substrate and the second connector is arranged at a position away from the control device on the substrate. The cable assembly includes a cable row, a paddle card substrate and a hot melt material. In the cable row a plurality of cables each transmitting a differential signal are arranged side by side. The paddle card substrate is provided with signal electrodes and ground electrodes, internal conductors of the plurality of cables are electrically connected to the signal electrodes. External conductors of the plurality of cables are electrically connected to the ground electrodes.

Provided is a heat sink unit that is less likely to damage a package and has excellent handleability. The heat sink unit 1 includes a base 90, a cover 20, a first lever 80, a third lever 50, and a heat sink 30. The first lever 80 is rotatably held by the base 90, carries the heat sink 30 and a heat sink pedestal 40, and is hard stopped at the base 90 by an end portion of the first lever 80. The third lever 50 is rotatably held by the cover 20, is connected to the first lever 80 to open and close the same, and controls up-and-down movements of the heat sink pedestal 40 by a tip end of the third lever 50. The heat sink 30 is configured to press the IC package 100 with timing shifted by a long hole of the third lever 50 after the first lever 80 is hard stopped at the base 90.

Provided are a probe and a socket for inspection that cause the probe to be in direct contact with a housing and are not required to have high dimensional accuracy in the manufacturing thereof. A probe for grounding to be inserted through a through-hole, which is formed in a housing and defined by a metal inner circumferential wall, includes: a probe body including a cylindrical barrel extending in the direction of a first axis and a plunger; and a spring member through which the barrel is inserted, the spring member includes a coil part wound about a second axis, the barrel being inserted through the coil part in the direction of the second axis, and includes a protruding part formed continuously to the coil part and protruding outward from an outer circumferential face of the coil part to be in elastic contact with the inner circumferential wall, and the coil part presses the probe body against the inner circumferential wall by elasticity of the protruding part.