Fan-Out & Embedded Die Packaging

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

5,803 US filings from 507 companies since 2023 · 2023: 1,506 · 2024: 1,904 · 2025: 1,869 · 2026 YTD: 524

Chip-to-Chip Interconnect (Bonding, Bumps)Multi-Chip & 3D AssembliesSemiconductor Packaging & Encapsulation

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#	Company	Since 2023	2023	2024	2025	2026 YTD	YoY
1	Taiwan Semiconductor Manufacturing Company, Ltd.	1,376	358	522	418	78	-19.9%
2	Taiwan Semiconductor Manufacturing Co., Ltd.	624	147	178	258	41	+44.9%
3	INTEL CORPORATION	589	181	167	174	67	+4.2%
4	SAMSUNG ELECTRONICS CO., LTD.	328	72	122	102	32	-16.4%
5	TEXAS INSTRUMENTS INCORPORATED	231	66	74	74	17	0.0%
6	Taiwan Semiconductor Manufacturing Company Limited	150	33	41	65	11	+58.5%
7	Micron Technology, Inc.	136	36	54	30	16	-44.4%
8	QUALCOMM Incorporated	81	17	18	35	11	+94.4%
9	Qorvo US, Inc.	74	28	31	9	6	-71.0%
10	Apple Inc.	60	13	18	25	4	+38.9%
11	Infineon Technologies AG	60	16	24	17	3	-29.2%
12	MEDIATEK INC.	60	23	17	11	9	-35.3%
13	Advanced Micro Devices, Inc.	55	13	12	21	9	+75.0%
14	ADVANCED SEMICONDUCTOR ENGINEERING, INC.	54	17	20	10	7	-50.0%
15	NXP USA, INC.	51	12	19	17	3	-10.5%
16	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC	47	4	19	17	7	-10.5%
17	Adeia Semiconductor Bonding Technologies Inc.	46	13	14	16	3	+14.3%
18	InnoLux Corporation	44	8	14	19	3	+35.7%
19	Skyworks Solutions, Inc.	42	14	14	8	6	-42.9%
20	NXP B.V.	37	10	10	14	3	+40.0%
21	International Business Machines Corporation	35	16	10	6	3	-40.0%
22	SJ Semiconductor (Jiangyin) Corporation	32	12	11	4	5	-63.6%
23	Samsung Electro-Mechanics Co., Ltd.	31	5	6	15	5	+150.0%
24	SILICONWARE PRECISION INDUSTRIES CO., LTD.	31	7	9	12	3	+33.3%
25	STMICROELECTRONICS S.r.l.	31	9	13	7	2	-46.2%