Patent Theme

Laser Module Packaging

Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.

6,870 US filings from 1,281 companies since 2023 · 2023: 1,756 · 2024: 2,172 · 2025: 2,126 · 2026 YTD: 816

Lasers

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.