Patent Theme
Advanced Electronic Packaging
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
31,016 US filings from 3,535 companies since 2023 · 2023: 7,916 · 2024: 9,894 · 2025: 9,737 · 2026 YTD: 3,469
Printed Circuits & Electronic Assemblies
Top companies
Ranked by filings in this theme since 2023. 2026 is partial.
| # | Company | Since 2023 | 2023 | 2024 | 2025 | 2026 YTD | YoY |
|---|
| 1 | SAMSUNG ELECTRONICS CO., LTD. | 3,302 | 780 | 963 | 1,145 | 414 | +18.9% |
| 2 | Taiwan Semiconductor Manufacturing Company, Ltd. | 1,506 | 397 | 544 | 481 | 84 | -11.6% |
| 3 | INTEL CORPORATION | 1,346 | 389 | 427 | 401 | 129 | -6.1% |
| 4 | Murata Manufacturing Co., Ltd. | 721 | 202 | 213 | 224 | 82 | +5.2% |
| 5 | Apple Inc. | 607 | 175 | 210 | 173 | 49 | -17.6% |
| 6 | InnoLux Corporation | 564 | 150 | 168 | 194 | 52 | +15.5% |
| 7 | DELL PRODUCTS L.P. | 560 | 122 | 169 | 189 | 80 | +11.8% |
| 8 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 534 | 168 | 169 | 146 | 51 | -13.6% |
| 9 | TEXAS INSTRUMENTS INCORPORATED | 482 | 132 | 162 | 145 | 43 | -10.5% |
| 10 | Samsung Display Co., Ltd. | 476 | 141 | 124 | 150 | 61 | +21.0% |
| 11 | Taiwan Semiconductor Manufacturing Co., Ltd. | 455 | 117 | 126 | 187 | 25 | +48.4% |
| 12 | Infineon Technologies AG | 420 | 123 | 131 | 122 | 44 | -6.9% |
| 13 | Samsung Electro-Mechanics Co., Ltd. | 332 | 80 | 91 | 113 | 48 | +24.2% |
| 14 | Micron Technology, Inc. | 312 | 83 | 117 | 80 | 32 | -31.6% |
| 15 | SILICONWARE PRECISION INDUSTRIES CO., LTD. | 304 | 53 | 96 | 123 | 32 | +28.1% |
| 16 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | 279 | 55 | 108 | 98 | 18 | -9.3% |
| 17 | LG INNOTEK CO., LTD. | 258 | 54 | 80 | 93 | 31 | +16.2% |
| 18 | QUALCOMM Incorporated | 245 | 68 | 63 | 86 | 28 | +36.5% |
| 19 | Huawei Technologies Co., Ltd. | 238 | 67 | 67 | 73 | 31 | +9.0% |
| 20 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC | 213 | 40 | 75 | 78 | 20 | +4.0% |
| 21 | International Business Machines Corporation | 211 | 77 | 69 | 43 | 22 | -37.7% |
| 22 | STATS ChipPAC Pte. Ltd. | 195 | 54 | 61 | 62 | 18 | +1.6% |
| 23 | BOE Technology Group Co., Ltd. | 166 | 35 | 68 | 44 | 19 | -35.3% |
| 24 | Wacom Co., Ltd. | 166 | 36 | 54 | 53 | 23 | -1.9% |
| 25 | KYOCERA CORPORATION | 159 | 33 | 63 | 50 | 13 | -20.6% |